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2026 Hardware Engineer Summer Intern of Client Solutions Group (ME)
Dell Technologies
Full-time
Taipei, Taiwan
other-general
Posted:
February 27, 2026
Location:
Taipei, Taiwan, Taiwan
Job Description
**2026 Hardware Engineer Summer Intern of Client Solutions Group** **(ME)**
The reputation of Dell Technologies for delivering award-winning hardware is legendary and our Hardware Engineering team is at the heart of it. We design and develop analogue as well as digital hardware products – not just computer or network hardware devices but peripherals too. Recognized for our high level of technical expertise in a variety of engineering disciplines, we’re involved across the development lifecycle – from research to the building, testing and delivery of completed products. Innovators in our field, we lead the way in exploring new concepts, approaches, processes, materials and components.
Join us as a **Hardware Engineer Summer Intern** on our **Engineering Development** ** ** team in **Taipei ** to do the best work of your career and make a profound social impact.
**What ** **you’ll** ** achieve**
As a Hardware Engineer ...
The reputation of Dell Technologies for delivering award-winning hardware is legendary and our Hardware Engineering team is at the heart of it. We design and develop analogue as well as digital hardware products – not just computer or network hardware devices but peripherals too. Recognized for our high level of technical expertise in a variety of engineering disciplines, we’re involved across the development lifecycle – from research to the building, testing and delivery of completed products. Innovators in our field, we lead the way in exploring new concepts, approaches, processes, materials and components.
Join us as a **Hardware Engineer Summer Intern** on our **Engineering Development** ** ** team in **Taipei ** to do the best work of your career and make a profound social impact.
**What ** **you’ll** ** achieve**
As a Hardware Engineer ...
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Job Type:
Full-time
Location:
Taipei, Taiwan
Posted:
February 27, 2026
Deadline:
March 05, 2026