Advanced Package Designer

Onsemi

Full-time Taiwan, Taiwan Drafters, Engineering Technicians, and Mapping Technicians

Posted:

March 01, 2026

Location:

Taiwan, Taiwan, Taiwan

Job Description

We are seeking an Advanced Packaging Designer to join our design team. This role will focus on designing, verifying, and documenting innovative IC packaging solutions to meet electrical, mechanical, and thermal requirements while ensuring compliance with industry standards (JEDEC, IPC, ISO) and internal specifications. The designer will collaborate with cross-functional teams to deliver manufacturable, reliable, and audit-ready package designs.
Develop IC package designs that include a combination of substrate, lead frame, wirebond, flip-chip, wafer-level and other advanced packaging technologies.
Apply fabrication, assembly and test constraints in designs.
Generate detailed drawings, 3D models, and documentation for manufacturing and audits.
Work closely with package design engineers, test engineers, and manufacturing teams.
Present technical data in actionable, traceable formats for audits and stakeholders.
Partner with supply c...
                

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Job Overview

Job Type: Full-time

Location: Taiwan, Taiwan

Posted: March 01, 2026

Deadline: April 10, 2026