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AI Engineering Intern, SG
Augmentus Robotics
Full-time
Singapore, Singapore
Automation Machinery Manufacturing
Posted:
February 25, 2026
Location:
Singapore, Singapore, Singapore
Job Description
What we do
Augmentus is a leading provider of robotic programming solutions that simplify and streamline traditionally complex industrial automation processes. Our innovative solution integrates cutting-edge features like 3D scanning, automated path optimization, and seamless robot code generation to make programming accessible and efficient for manufacturers handling high-mix, high-part complexity operations. Trusted by global leaders in industries such as media blasting, painting, and welding, Augmentus empowers companies to achieve scalability, reliability, and superior operational efficiency. Join us to revolutionize the future of robotics and automation.
About Your Role
Automate and Orchestrate Internal Processes
Augmentus is a leading provider of robotic programming solutions that simplify and streamline traditionally complex industrial automation processes. Our innovative solution integrates cutting-edge features like 3D scanning, automated path optimization, and seamless robot code generation to make programming accessible and efficient for manufacturers handling high-mix, high-part complexity operations. Trusted by global leaders in industries such as media blasting, painting, and welding, Augmentus empowers companies to achieve scalability, reliability, and superior operational efficiency. Join us to revolutionize the future of robotics and automation.
About Your Role
Automate and Orchestrate Internal Processes
- Design, implement, and optimize internal automation workflows to streamline operations across teams.
- Build and maintain automation pipelines : n8n , Python , JavaScript , Supabase , Pinecone , NotebookLM
Apply for this Job
Submit your application for the AI Engineering Intern, SG position at Augmentus Robotics.
Apply Now Save for LaterJob Overview
Job Type:
Full-time
Location:
Singapore, Singapore
Posted:
February 25, 2026
Deadline:
April 06, 2026