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Application Engineer I – Silicon Package Board
Cadence Design Systems, Inc.
Full-time
Belo Horizonte, Brazil
other-general
Posted:
June 15, 2026
Location:
Belo Horizonte, Brazil, Brazil
Job Description
At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology.
Cadence Design Systems (http://www.cadence.com.) is looking for a candidate to join the Silicon Package Board (SPB) team as a full-time engineer focused on printed circuit boards (PCBs). If you like to architect and develop solutions for challenging problems in a fast and innovative paced environment, using state of the art technology this is a great opportunity.
The Candidate will be trained on the Cadence Allegro tool set, working with state-of-the-art complex PCB designs. Understanding competitive technologies is a plus. Ability to understand schematic, layout, interposers, integrated components.
Job Description:
+ Helping customers to adopt and proliferate our packaging solutions
+ Conducting technical presentations, technical training, and product demonstrations, including development of customized presentations
+...
Cadence Design Systems (http://www.cadence.com.) is looking for a candidate to join the Silicon Package Board (SPB) team as a full-time engineer focused on printed circuit boards (PCBs). If you like to architect and develop solutions for challenging problems in a fast and innovative paced environment, using state of the art technology this is a great opportunity.
The Candidate will be trained on the Cadence Allegro tool set, working with state-of-the-art complex PCB designs. Understanding competitive technologies is a plus. Ability to understand schematic, layout, interposers, integrated components.
Job Description:
+ Helping customers to adopt and proliferate our packaging solutions
+ Conducting technical presentations, technical training, and product demonstrations, including development of customized presentations
+...
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Job Type:
Full-time
Location:
Belo Horizonte, Brazil
Posted:
June 15, 2026
Deadline:
June 20, 2026