Assistant Engineer Sustaining

Your Role
Key responsibilities in your new role
Responsible for Wire Bond Development in A project and any assigned projects with objective of ensuring the project target and scope are meeting the corporate goals.
To convert and set-up die bonder/ wire bonder in preparation for new evaluation/ engineering/ qualification build.
To perform engineering data measurement, collection and data compilation.
Capable to analyze the engineering data in case of abnormality.
To support builds from development to baseload/ramp up.
To provide technical support from development to baseload/ ramp up.
To perform other duties as assigned by superior.
Your Profile
Qualifications And Skills To Help You Succeed
Minimum Diploma in Mechanical/ Electronic/ Electrical Engineering.
5 years working experience in semiconductor with die attach and wire bond process experience preferable on Die bonder : ESEC/ ASM & Wire bonder :Shinkawa /ASM.
Capable to create new machine to c...