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Bloomberg Intelligence Technology Mid-Cap Analyst, APAC and EMEA
Bloomberg
Full-time
Hong Kong, Hong Kong
other-general
Posted:
February 28, 2026
Location:
Hong Kong, Hong Kong, Hong Kong
Job Description
Bloomberg Intelligence Technology Mid-Cap Analyst, APAC and EMEA
Location
Hong Kong
Business Area
Research
Ref #
10049179
**Description & Requirements**
Bloomberg Intelligence provides comprehensive views on markets, themes, sectors, industries and companies, and combined with the power of the Bloomberg Professional® service, offers our customers unsurpassed depth and breadth of analysis. Bloomberg Intelligence also offers valuable written analysis, data, and interactive charting and functions from a team of independent experts, giving investment and corporate professionals deep insights. Research that generates creative investment ideas and simplifies strategic and financing decisions - that's intelligence our clients can count on.
We’re looking for a highly motivated research analyst focusing on the technology sector coverage in the Asia Pacific and EMEA regions. As part of our global tech research team,...
Location
Hong Kong
Business Area
Research
Ref #
10049179
**Description & Requirements**
Bloomberg Intelligence provides comprehensive views on markets, themes, sectors, industries and companies, and combined with the power of the Bloomberg Professional® service, offers our customers unsurpassed depth and breadth of analysis. Bloomberg Intelligence also offers valuable written analysis, data, and interactive charting and functions from a team of independent experts, giving investment and corporate professionals deep insights. Research that generates creative investment ideas and simplifies strategic and financing decisions - that's intelligence our clients can count on.
We’re looking for a highly motivated research analyst focusing on the technology sector coverage in the Asia Pacific and EMEA regions. As part of our global tech research team,...
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Job Type:
Full-time
Location:
Hong Kong, Hong Kong
Posted:
February 28, 2026
Deadline:
March 05, 2026