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Posted:
June 07, 2026
Location:
Tel Aviv, Israel, Israel
Job Description
Description
Annapurna Labs, an Amazon team, designs and delivers high-end, custom silicon at the heart of AWS. Our chips don't just support the cloud; they define it. From Trainium, the purpose-built ML accelerator driving the next wave of AI innovation, to Graviton, the Arm-based server processor redefining price-performance for compute workloads, to Nitro, the advanced network and cloud management controller that underpins every AWS instance — Annapurna's products set the standard for the industry.
We're looking for a talented Chip Design Engineer to join our Nitro team in Tel Aviv and help shape what comes next.
What you'll do:
*Take an active, hands-on role in developing the next generation of the Nitro platform https://aws.amazon.com/ec2/nitro/
*Own critical IP blocks end-to-end — from architecture through tape-out
*Collaborate with a world-class, fast-moving design team and see your work deployed at a scale no other platform can match, powering hund...
Annapurna Labs, an Amazon team, designs and delivers high-end, custom silicon at the heart of AWS. Our chips don't just support the cloud; they define it. From Trainium, the purpose-built ML accelerator driving the next wave of AI innovation, to Graviton, the Arm-based server processor redefining price-performance for compute workloads, to Nitro, the advanced network and cloud management controller that underpins every AWS instance — Annapurna's products set the standard for the industry.
We're looking for a talented Chip Design Engineer to join our Nitro team in Tel Aviv and help shape what comes next.
What you'll do:
*Take an active, hands-on role in developing the next generation of the Nitro platform https://aws.amazon.com/ec2/nitro/
*Own critical IP blocks end-to-end — from architecture through tape-out
*Collaborate with a world-class, fast-moving design team and see your work deployed at a scale no other platform can match, powering hund...
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Job Type:
Full-time
Location:
Tel Aviv, Israel
Posted:
June 07, 2026
Deadline:
June 13, 2026