CUF TD Module Engineer

# **Welcome!**## .CUF TD Module Engineer page is loaded## CUF TD Module Engineerlocations: Malaysia, Kulimtime type: Full timeposted on: Posted Todayjob requisition id: JR # **Job Details:**## Job Description:Note: This role requires regular onsite presence to fulfill essential job responsibilities.* Develops assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies.* Optimizes and improves the efficiency of manufacturing of packages, developing processes to meet quality, reliability, cost, yield, productivity and manufacturability requirements.* Develops process and equipment specifications applying principles for design of experiments and data analysis, and documents improvements through white papers.* Develops and maintains equipment to evaluate silicon and package technologies under simulated field use conditions, such as heat, humidity, temperature cycle, and dynamic ...