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Director of Engineering for Hyperscale Data Center Infrastructure
RCM Technologies
Full-time
United States, United States
other-general
Posted:
February 28, 2026
Location:
United States, United States, United States
Job Description
Direct Placement Title or Role: Director of Engineering Compensation: Up to $275,000 + equity + bonus. Commensurate with Experience Location: US Hybrid Company Description:
Our Client is a U.S.-based leader in large-scale data center development, specializing in high-performance computing (HPC) infrastructure. Headquartered in New York, with locations throughout the U.S. they are building next-generation platforms for AI and data-intensive applications. With a strong focus on sustainability, Our Client leverages renewable energy and advanced cooling technologies to deliver efficient, cost-effective solutions. Position Description:
The Director of Engineering for Hyperscale Data Center Infrastructure will lead and integrate multidisciplinary engineering efforts across a rapidly expanding portfolio of data center projects. This pivotal role ensures the technical coherence of the platform, aligning engineering disciplines to optimize fast-track execution, scalability, a...
Our Client is a U.S.-based leader in large-scale data center development, specializing in high-performance computing (HPC) infrastructure. Headquartered in New York, with locations throughout the U.S. they are building next-generation platforms for AI and data-intensive applications. With a strong focus on sustainability, Our Client leverages renewable energy and advanced cooling technologies to deliver efficient, cost-effective solutions. Position Description:
The Director of Engineering for Hyperscale Data Center Infrastructure will lead and integrate multidisciplinary engineering efforts across a rapidly expanding portfolio of data center projects. This pivotal role ensures the technical coherence of the platform, aligning engineering disciplines to optimize fast-track execution, scalability, a...
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Job Type:
Full-time
Location:
United States, United States
Posted:
February 28, 2026
Deadline:
March 06, 2026