GE
Posted:
February 28, 2026
Location:
Bengaluru, India, India
Job Description
**Job Description Summary**
EEDP is an intensive program for people who have a passion for technology, a drive for technical excellence, and share in GE Vernova core beliefs. The program is designed to accelerate participants' professional development through intense technical training and a variety of business-critical assignments. Edison graduates have the technical and business foundation to proactively and continually make innovative contributions to GE Vernova future.
**Job Description**
**Essential Responsibilities**
If you love technology and want a career in engineering, the Edison Engineering Development Program is for you! EEDP is a two-year entry-level program consisting of four or more rotational assignments. Rotational assignments are engineering projects driven by real GE Vernova business priorities. The program cultivates technical problem-solving skills via advanced engineering coursework, formal reports and presentations to senior leadersh...
EEDP is an intensive program for people who have a passion for technology, a drive for technical excellence, and share in GE Vernova core beliefs. The program is designed to accelerate participants' professional development through intense technical training and a variety of business-critical assignments. Edison graduates have the technical and business foundation to proactively and continually make innovative contributions to GE Vernova future.
**Job Description**
**Essential Responsibilities**
If you love technology and want a career in engineering, the Edison Engineering Development Program is for you! EEDP is a two-year entry-level program consisting of four or more rotational assignments. Rotational assignments are engineering projects driven by real GE Vernova business priorities. The program cultivates technical problem-solving skills via advanced engineering coursework, formal reports and presentations to senior leadersh...
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Job Type:
Full-time
Location:
Bengaluru, India
Posted:
February 28, 2026
Deadline:
March 05, 2026