UT
Electroplating & Wet Process Engineer - Yield & Quality
UTAC
Full-time
singapore, singapore
Other-General
Posted:
June 05, 2026
Location:
singapore, singapore, Singapore
Job Description
UTAC in Singapore is seeking a technical professional to develop and optimize electroplating processes. Key responsibilities include monitoring plating performance, leading troubleshooting efforts, and collaborating with cross-functional teams for quality improvement. The ideal candidate holds a degree in Chemical Engineering or related fields, with preferred experience in semiconductor packaging and knowledge of plating chemistry. This role requires strong analytical skills and the ability to work in a cleanroom environment.
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Apply Now Save for LaterJob Overview
Job Type:
Full-time
Location:
singapore, Singapore
Posted:
June 05, 2026
Deadline:
July 15, 2026