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Embedded Linux Software Engineer (Mobile/AI SOC)
MediaTek
Full-time
Hsinchu City, Taiwan Province
Computer Occupations
Posted:
February 26, 2026
Location:
Hsinchu City, Taiwan Province, Taiwan
Job Description
Job DescriptionThe Embedded Software Engineer is responsible for System and Kernel to support MediaTek mobile/AI SoC.
Major responsibilities will be to:
1. Responsible for the development of Bootloader and Driver software and the development of IC verification environment.
2. Execute IC bring up and software system integration work, lead the tracking of progress and assist in solving software system problems
3. Responsible for software system integration and System error analysis.
#LI-LYNNRequirement1. Has experience in embedded Linux development preferred
2. Has experience in Linux kernel, driver development
3. Strong programming skills in C language. Familiar with Assembly language preferred.
4. Knowledge and experience with multi-core/ARM CPU programming are better
5.Great communication and teamwork skill
6.Great planning and executing capability
Major responsibilities will be to:
1. Responsible for the development of Bootloader and Driver software and the development of IC verification environment.
2. Execute IC bring up and software system integration work, lead the tracking of progress and assist in solving software system problems
3. Responsible for software system integration and System error analysis.
#LI-LYNNRequirement1. Has experience in embedded Linux development preferred
2. Has experience in Linux kernel, driver development
3. Strong programming skills in C language. Familiar with Assembly language preferred.
4. Knowledge and experience with multi-core/ARM CPU programming are better
5.Great communication and teamwork skill
6.Great planning and executing capability
Apply for this Job
Submit your application for the Embedded Linux Software Engineer (Mobile/AI SOC) position at MediaTek.
Apply Now Save for LaterJob Overview
Job Type:
Full-time
Location:
Hsinchu City, Taiwan
Posted:
February 26, 2026
Deadline:
April 07, 2026