Engineer Unit Process Engineering Die Attach

Infineon Technologies
Full-time Malaysia, Malaysia Other-General
Posted:
February 26, 2026
Location:
Malaysia, Malaysia, Malaysia

Job Description

Quality improvement activities on DDM investigation, disposition and improvement.
Your Role
Key responsibilities in your new role
Yield improvement activities for Die Attach process.
Sustain and achieve stability index for package under responsibility.
Support production on daily issues investigation and improvement in order to achieve Operation performance.
Sustain and achieve quality stability for DA process to achieve zero spill, FAR.
Documents update and refine to ensure no expired documents.
Key driver for yield improvement topic for Die Attach process.
Your Profile
Qualifications And Skills To Help You Succeed
Bachelor degree in engineering.
Knowledge in die attach process and skill.
Knowledge in process engineering.
Basic statistical and SPC knowledge.
Basic problem solving skill.
#WeAreIn for driving decarbonization and digitalization.
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Job Overview

Job Type: Full-time
Location: Malaysia, Malaysia
Posted: February 26, 2026
Deadline: April 07, 2026