Engineer Unit Process Engineering Die Bond

Infineon Technologies
Full-time Malaysia, Malaysia Other-General
Posted:
March 02, 2026
Location:
Malaysia, Malaysia, Malaysia

Job Description

Die Bond expert, responsible to achieve robust and auto-pilot processes.
Your Role
Key responsibilities in your new role
Supports development of new technologies and ensures smooth take-over into volume production and integration into manufacturing environment.
Accountable and drive for 8D closure of FAR, MRB, DDM, LOH and SDCAR.
Leading and participating in yield & quality improvement and cost reduction activities.
As a technical expert in new material, process and method qualification.
Provide technical consultation and guidance team to ensure team success in daily tasks and projects.
Support on auditing activities .
Your Profile
Qualifications And Skills To Help You Succeed
Bachelor's or Master degree in Mechanical, Manufacturing, Electronics or related Engineering.
More than 2 years related experience in FOL Process Engineering or in Semiconductor Assembly Manufacturing background.
Die Bond Process.
Process & product control.
Productivit...

Apply for this Job

Submit your application for the Engineer Unit Process Engineering Die Bond position at Infineon Technologies.

Apply Now Save for Later

Job Overview

Job Type: Full-time
Location: Malaysia, Malaysia
Posted: March 02, 2026
Deadline: April 11, 2026