In
Engineer Unit Process Engineering Die Bond
Infineon Technologies
Full-time
Malaysia, Malaysia
Other-General
Posted:
March 02, 2026
Location:
Malaysia, Malaysia, Malaysia
Job Description
Die Bond expert, responsible to achieve robust and auto-pilot processes.
Your Role
Key responsibilities in your new role
Supports development of new technologies and ensures smooth take-over into volume production and integration into manufacturing environment.
Accountable and drive for 8D closure of FAR, MRB, DDM, LOH and SDCAR.
Leading and participating in yield & quality improvement and cost reduction activities.
As a technical expert in new material, process and method qualification.
Provide technical consultation and guidance team to ensure team success in daily tasks and projects.
Support on auditing activities .
Your Profile
Qualifications And Skills To Help You Succeed
Bachelor's or Master degree in Mechanical, Manufacturing, Electronics or related Engineering.
More than 2 years related experience in FOL Process Engineering or in Semiconductor Assembly Manufacturing background.
Die Bond Process.
Process & product control.
Productivit...
Your Role
Key responsibilities in your new role
Supports development of new technologies and ensures smooth take-over into volume production and integration into manufacturing environment.
Accountable and drive for 8D closure of FAR, MRB, DDM, LOH and SDCAR.
Leading and participating in yield & quality improvement and cost reduction activities.
As a technical expert in new material, process and method qualification.
Provide technical consultation and guidance team to ensure team success in daily tasks and projects.
Support on auditing activities .
Your Profile
Qualifications And Skills To Help You Succeed
Bachelor's or Master degree in Mechanical, Manufacturing, Electronics or related Engineering.
More than 2 years related experience in FOL Process Engineering or in Semiconductor Assembly Manufacturing background.
Die Bond Process.
Process & product control.
Productivit...
Apply for this Job
Submit your application for the Engineer Unit Process Engineering Die Bond position at Infineon Technologies.
Apply Now Save for LaterJob Overview
Job Type:
Full-time
Location:
Malaysia, Malaysia
Posted:
March 02, 2026
Deadline:
April 11, 2026