Expert in Substrate Cutting & Polishing Process (f/m/d)

You will be responsible for the development and execution of projects in the field of cutting and polishing SiC substrates

Within your area of responsibility, you will lead the manufacturing processes for SiC power components related to substrate cutting and polishing modules, ensuring timely solutions to quality issues and smooth operations during the ramp-up, pre-production, and production phases

Monitoring and tracking engineering processes, as well as deriving appropriate corrective actions, will be your responsibility. This includes analyzing and summarizing process data from engineering batches and addressing relevant technical issues

You will become an expert in product reliability requirements, testing methods, and evaluations

Your daily focus will be on increasing productivity and tackling major challenges