Me
Posted:
June 05, 2026
Location:
Japan, Tokyo, Japan
Job Description
Job DescriptionJob Description:
1.Business Development and Technical Sales Lead for high performance computing SoC on Gaming and Automotive.
2. Support Automotive, ASIC, and other consumer products for spec confirmation, communicate with our team and cowork with customers to confirm project requirement and spec
3. Support Automotive, ASIC, and other consumer products during development, technical communication between customers and our Taiwan/China/India team, understand customer’s requirement and our development process.
4. Support Automotive, ASIC, and other consumer products during testing. First line handling the issues, and cowork with our team to fix the issues.
Requirement1. Above 10 years FAE experience on ASIC/SoC products.
2. Excellent coordination and communication skills, clearly information delivery, customer background intention dig out and relationship creation.
3. Technique required to ASIC, peripheral/EVB, and Linux/Android driver/syst...
1.Business Development and Technical Sales Lead for high performance computing SoC on Gaming and Automotive.
2. Support Automotive, ASIC, and other consumer products for spec confirmation, communicate with our team and cowork with customers to confirm project requirement and spec
3. Support Automotive, ASIC, and other consumer products during development, technical communication between customers and our Taiwan/China/India team, understand customer’s requirement and our development process.
4. Support Automotive, ASIC, and other consumer products during testing. First line handling the issues, and cowork with our team to fix the issues.
Requirement1. Above 10 years FAE experience on ASIC/SoC products.
2. Excellent coordination and communication skills, clearly information delivery, customer background intention dig out and relationship creation.
3. Technique required to ASIC, peripheral/EVB, and Linux/Android driver/syst...
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Submit your application for the Field Application Engineer position at MediaTek.
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Job Type:
Full-time
Location:
Japan, Japan
Posted:
June 05, 2026
Deadline:
July 15, 2026