Re
Posted:
February 27, 2026
Location:
Shenzhen, China, China
Job Description
Graduate Application Engineer- MCU /MPU
Job Description
**Job Summary**
Renesas Electronics China (RECH) is seeking a Graduate Engineer to join the Microcontroller (MCU) Application Engineering team to provide high quality application and product support directly to our customers through multiple contact channels.
This is an entry level position ideally suited to a talented Electronic Engineering graduate with strong embedded software skills. The AE role encompasses a broad range of disciplines so a desire for continuous development is strongly sought.
The Graduate Engineer will initially be exposed to all products, technologies, and disciplines from the MCU application engineering department, gaining a broad range of experience and skills through collaboration with the senior engineers, whilst identifying and developing an application area specialism uniquely suited to their own skillset...
Job Description
**Job Summary**
Renesas Electronics China (RECH) is seeking a Graduate Engineer to join the Microcontroller (MCU) Application Engineering team to provide high quality application and product support directly to our customers through multiple contact channels.
This is an entry level position ideally suited to a talented Electronic Engineering graduate with strong embedded software skills. The AE role encompasses a broad range of disciplines so a desire for continuous development is strongly sought.
The Graduate Engineer will initially be exposed to all products, technologies, and disciplines from the MCU application engineering department, gaining a broad range of experience and skills through collaboration with the senior engineers, whilst identifying and developing an application area specialism uniquely suited to their own skillset...
Apply for this Job
Submit your application for the Graduate Application Engineer- MCU /MPU position at Renesas.
Apply Now Save for LaterJob Overview
Job Type:
Full-time
Location:
Shenzhen, China
Posted:
February 27, 2026
Deadline:
April 01, 2026