Re
Posted:
March 03, 2026
Location:
Bayan Lepas, Malaysia, Malaysia
Job Description
Graduate Process Engineer
Job Description
As a **Die Bond & Wire Bond Engineer** , you will be part of a dynamic manufacturing team, supporting semiconductor assembly processes from development to mass production. This role is ideal for fresh graduates who are eager to learn, hands-on, and passionate about process improvement.
+ Support the development, optimization, and maintenance of die bond and wire bond processes to ensure good quality, yield, and reliability
+ Assist in troubleshooting process issues and perform root cause analysis for defects, yield loss, or equipment-related problems
+ Participate in new product introduction (NPI), process qualification, and transition to mass production
+ Help establish and update process parameters, work instructions, and control plans
+ Analyze process data using basic statistical tools such as SPC, CPK, and trend analysis
+ Work closel...
Job Description
As a **Die Bond & Wire Bond Engineer** , you will be part of a dynamic manufacturing team, supporting semiconductor assembly processes from development to mass production. This role is ideal for fresh graduates who are eager to learn, hands-on, and passionate about process improvement.
+ Support the development, optimization, and maintenance of die bond and wire bond processes to ensure good quality, yield, and reliability
+ Assist in troubleshooting process issues and perform root cause analysis for defects, yield loss, or equipment-related problems
+ Participate in new product introduction (NPI), process qualification, and transition to mass production
+ Help establish and update process parameters, work instructions, and control plans
+ Analyze process data using basic statistical tools such as SPC, CPK, and trend analysis
+ Work closel...
Apply for this Job
Submit your application for the Graduate Process Engineer position at Renesas.
Apply Now Save for LaterJob Overview
Job Type:
Full-time
Location:
Bayan Lepas, Malaysia
Posted:
March 03, 2026
Deadline:
April 05, 2026