Ci
Posted:
June 06, 2026
Location:
Taipei, Taiwan, Taiwan
Job Description
**Meet the Team**
Our team is dedicated to ensuring end-to-end product reliability across surface mount technology (SMT), printed circuit board (PCB) design, materials, and system-level thermal solutions for high-speed platforms including Server, Networking, and AI systems. We collaborate closely with cross-functional teams and suppliers to drive failure resolution and design optimization, leveraging data, physics, and engineering judgment. The team is composed of experienced engineers who thrive in a dynamic environment focused on innovation and reliability. What excites us most is owning the full thermal stack and its impact on product reliability, making a critical difference in cutting-edge technology performance.
**Your Impact**
In this role, you will own the end-to-end product reliability, focusing on SMT, PCB design, materials, and system-level thermal solutions. You will drive failure resolution and design optimization through data analysis, physics u...
Our team is dedicated to ensuring end-to-end product reliability across surface mount technology (SMT), printed circuit board (PCB) design, materials, and system-level thermal solutions for high-speed platforms including Server, Networking, and AI systems. We collaborate closely with cross-functional teams and suppliers to drive failure resolution and design optimization, leveraging data, physics, and engineering judgment. The team is composed of experienced engineers who thrive in a dynamic environment focused on innovation and reliability. What excites us most is owning the full thermal stack and its impact on product reliability, making a critical difference in cutting-edge technology performance.
**Your Impact**
In this role, you will own the end-to-end product reliability, focusing on SMT, PCB design, materials, and system-level thermal solutions. You will drive failure resolution and design optimization through data analysis, physics u...
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Job Type:
Full-time
Location:
Taipei, Taiwan
Posted:
June 06, 2026
Deadline:
June 10, 2026