HS
Head of APAC Issuer Services, Global Shared Services
HSBC
Full-time
Kuala Lumpur, Malaysia
other-general
Posted:
June 08, 2026
Location:
Kuala Lumpur, Malaysia, Malaysia
Job Description
Head of APAC Issuer Services, Global Shared Services
Location:
Kuala Lumpur, Federal Territory of Kuala Lumpur, MY, 55188
Brand: HSBC
Area of Interest: Investment Banking, Markets, and Research
Closing Date: Hybrid Worker
Date: 21 May 2026
**Job description**
**Why join us?**
Issuer Service provides trustee and agency services across a wide range of products, including Escrows, Project & Export Finance, Securitization, Loans and Debt programmes. Our proposition enables clients to pursue international capital market activities: we expedite movements of cash and securities, protect the rights of interested parties and we assist our colleagues in Corporate Investment Banking (CIB) with the identification of ISV solutionns to meet client requirements. Corporate Trust APAC team authorize/validate/monitor and ensure the processing and administration of all types of Bonds where HSBC acts as the Issuing and Paying agent...
Location:
Kuala Lumpur, Federal Territory of Kuala Lumpur, MY, 55188
Brand: HSBC
Area of Interest: Investment Banking, Markets, and Research
Closing Date: Hybrid Worker
Date: 21 May 2026
**Job description**
**Why join us?**
Issuer Service provides trustee and agency services across a wide range of products, including Escrows, Project & Export Finance, Securitization, Loans and Debt programmes. Our proposition enables clients to pursue international capital market activities: we expedite movements of cash and securities, protect the rights of interested parties and we assist our colleagues in Corporate Investment Banking (CIB) with the identification of ISV solutionns to meet client requirements. Corporate Trust APAC team authorize/validate/monitor and ensure the processing and administration of all types of Bonds where HSBC acts as the Issuing and Paying agent...
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Job Type:
Full-time
Location:
Kuala Lumpur, Malaysia
Posted:
June 08, 2026
Deadline:
June 13, 2026