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Head of Semiconductor Manufacturing Planning and Fulfillment
Google
Full-time
New Taipei, Taiwan
other-general
Posted:
June 08, 2026
Location:
New Taipei, Taiwan, Taiwan
Job Description
Head of Semiconductor Manufacturing Planning and Fulfillment
_corporate_fare_ Google _place_ New Taipei, Banqiao District, New Taipei City, Taiwan; Zhubei, Zhubei City, Hsinchu County, Taiwan
**Advanced**
Experience owning outcomes and decision making, solving ambiguous problems and influencing stakeholders; deep expertise in domain.
_info_outline_
XGoogle welcomes people with disabilities.Note: By applying to this position you will have an opportunity to share your preferred working location from the following: **New Taipei, Banqiao District, New Taipei City, Taiwan; Zhubei, Zhubei City, Hsinchu County, Taiwan** .
**Minimum qualifications:**
+ Bachelor's degree or equivalent practical experience.
+ 10 years of experience in program or project management.
+ 10 years of experience in semiconductor planning and fulfillment, and experience with mobile SoC development flows and manufacturing processes for Foundry, Die Pre...
_corporate_fare_ Google _place_ New Taipei, Banqiao District, New Taipei City, Taiwan; Zhubei, Zhubei City, Hsinchu County, Taiwan
**Advanced**
Experience owning outcomes and decision making, solving ambiguous problems and influencing stakeholders; deep expertise in domain.
_info_outline_
XGoogle welcomes people with disabilities.Note: By applying to this position you will have an opportunity to share your preferred working location from the following: **New Taipei, Banqiao District, New Taipei City, Taiwan; Zhubei, Zhubei City, Hsinchu County, Taiwan** .
**Minimum qualifications:**
+ Bachelor's degree or equivalent practical experience.
+ 10 years of experience in program or project management.
+ 10 years of experience in semiconductor planning and fulfillment, and experience with mobile SoC development flows and manufacturing processes for Foundry, Die Pre...
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Job Type:
Full-time
Location:
New Taipei, Taiwan
Posted:
June 08, 2026
Deadline:
June 13, 2026