AU
Posted:
March 02, 2026
Location:
Singapore, Singapore, Singapore
Job Description
Company Description
Since its spin-off in September 2025 AUMOVIO continues the business of the former Continental group sector Automotive as an independent company. The technology and electronics company offers a wide-ranging portfolio that makes mobility safe, exciting, connected, and autonomous. This includes sensor solutions, displays, braking and comfort systems as well as comprehensive expertise in software, architecture platforms, and assistance systems for software-defined vehicles. In the fiscal year 2024 the business areas, which now belong to AUMOVIO, generated sales of 19.6 billion Euro. The company is headquartered in Frankfurt, Germany and has about 87.000 employees in more than 100 locations worldwide.
Job Description
Candidate will work on MMC_XXXX_28_BHPC project support Requirements Engineering topic.
What You’ll Do
Since its spin-off in September 2025 AUMOVIO continues the business of the former Continental group sector Automotive as an independent company. The technology and electronics company offers a wide-ranging portfolio that makes mobility safe, exciting, connected, and autonomous. This includes sensor solutions, displays, braking and comfort systems as well as comprehensive expertise in software, architecture platforms, and assistance systems for software-defined vehicles. In the fiscal year 2024 the business areas, which now belong to AUMOVIO, generated sales of 19.6 billion Euro. The company is headquartered in Frankfurt, Germany and has about 87.000 employees in more than 100 locations worldwide.
Job Description
Candidate will work on MMC_XXXX_28_BHPC project support Requirements Engineering topic.
What You’ll Do
- Help gather and analyze system & software requirements from engineers and stakeho...
Apply for this Job
Submit your application for the HPC Requirements Engineer Intern [IDA:00004] position at AUMOVIO.
Apply Now Save for LaterJob Overview
Job Type:
Full-time
Location:
Singapore, Singapore
Posted:
March 02, 2026
Deadline:
April 11, 2026