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IC & Module Reliability Engineer
microTECH Global Ltd
Permanent
Edinburgh, Scotland
Business Operations Specialists
Posted:
June 09, 2026
Location:
Edinburgh, Scotland, United Kingdom
Job Description
This client are pioneers in the future of Satellite Communication.
They are searching for an IC Reliability engineer to join their team in Edinburgh.
You will play a crucial role in ensuring the reliability, performance, and safety of our products at multiple levels of the manufacturing process is proven through defined, industry standard semiconductor and satellite communication product qualification programs.
Key tasks:
* Conduct reliability testing and analyses to identify failure points at IC, IC package, Module and Motherboard level.
* Develop and execute reliability test plans for semiconductor devices, including stress testing, accelerated life testing, and environmental testing.
* Implement and maintain reliability modelling and prediction tools to assess the long-term performance of semiconductor devices.
* Investigate root causes of failures, analyse failure data, and make recommendations to ...
They are searching for an IC Reliability engineer to join their team in Edinburgh.
You will play a crucial role in ensuring the reliability, performance, and safety of our products at multiple levels of the manufacturing process is proven through defined, industry standard semiconductor and satellite communication product qualification programs.
Key tasks:
* Conduct reliability testing and analyses to identify failure points at IC, IC package, Module and Motherboard level.
* Develop and execute reliability test plans for semiconductor devices, including stress testing, accelerated life testing, and environmental testing.
* Implement and maintain reliability modelling and prediction tools to assess the long-term performance of semiconductor devices.
* Investigate root causes of failures, analyse failure data, and make recommendations to ...
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Job Type:
Permanent
Location:
Edinburgh, United Kingdom
Posted:
June 09, 2026
Deadline:
July 19, 2026