IC Package Design Engineer: High-Density PCB Layout

A leading engineering firm in Malaysia is seeking an IC Package Design Engineer to execute high-density package layout designs. The role includes working with Mentor Graphics Xpedition to ensure designs meet electrical requirements and collaborating with the design team to meet project milestones. Candidates should have a Bachelor's or Master's in Electrical/Electronics Engineering, with at least 3 years of relevant experience. Strong communication skills in English and effective task management are essential for this position.
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