IC Package Design Engineer: High-Density Substrates

A leading tech company in Malaysia is seeking an IC Package Design Engineer. The role focuses on high density package layout designs, requiring expertise in Mentor Graphics Xpedition PCB and strong communication skills in English. Candidates should have a degree in Electrical/Electronics Engineering and at least 3 years of relevant experience. Responsibilities include conducting routing feasibility studies, managing design quality, and collaborating with teammates to meet milestones.
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