IC Package Design Engineer (Mentor Graphics Xpedition PCB) - Immediate

As a IC Package Design Engineer , you will be responsible for executing high density package layout designs across product portfolios (Test Chips, CPUs, Chipsets, SoC designs, Test Vehicles and more)

The responsibilities include but not be limited to:

• Routing feasibility studies
• Signal breakout & full path routing, including Length matching (Group/ Diff Pair) for Low-Speed IOs and High-Speed IOs (e.g. DDR, PCIe, SERDES)
• Power routing
• Package Ballmap assignment
• VSS Stitching (Vertical/ Horizontal)
• Design rule checks (DRCs) and DRC cleanup (e.g. Mentor DRC and PLA eDRC)
• Adhesion hole generation and touchup
• Routing over void report generation and fixes
• Return path report generation and cleanup

2.Using the Mentor Graphics Xpedition PCB software to design the substrate in compliance with existing design rules, electrical requirements, and processes.

3.Wo...