IC Package Design Engineer

As a IC Package Design Engineer, you will be responsible for executing high density package layout designs across product portfolios (Test Chips, CPUs, Chipsets, SoC designs, Test Vehicles and more)

Responsibilities

• Routing feasibility studies
• Signal breakout & full path routing, including Length matching (Group/ Diff Pair) for Low-Speed IOs and High-Speed IOs (e.g. DDR, PCIe, SERDES)
• Power routing
• Package Ballmap assignment
• VSS Stitching (Vertical/ Horizontal)
• Design rule checks (DRCs) and DRC cleanup (e.g. Mentor DRC and PLA eDRC)
• Adhesion hole generation and touchup
• Routing over void report generation and fixes
• Return path report generation and cleanup
• Using the Mentor Graphics Xpedition PCB software to design the substrate in compliance with existing design rules, electrical requirements, and processes
• Work together with assigned PDE to deliver Package d...