Integrated Circuit Package Design Engineer

We are seeking an experienced package design engineer for complex flip‑chip‑BGA packages for industry‑leading ASICs with high‑speed SerDes and very‑high‑power delivery needs. You will be part of a worldwide R&D team developing high‑performance package designs for ASICs for artificial intelligence (AI), networking, high‑performance computing (HPC), and 5G base stations. These designs include SerDes at 224G and higher, 5G RF/Microwave ADC/DAC, HBM, DDR5, and more. You'll have the opportunity to collaborate with the team to create the package structures needed to enable new designs and contribute to efficiency improvements for our design team.

• Design complex flip‑chip‑BGA packages for high‑speed SerDes and high‑power delivery needs.
• Collaborate with the worldwide R&D team to develop high‑performance package designs for ASICs used in AI, networking, HPC,...