He
Posted:
May 25, 2026
Location:
cambridge, on, Canada
Job Description
Engage with AI at HeitechSoft in Cambridge, ON through this hybrid internship. You will innovate with cutting-edge tools and solve real business problems effectively.
This AI Automation Internship targets students pursuing degrees in Computer Science, Engineering, or related fields. You’ll design and deploy intelligent solutions that showcase your talent while driving significant impact. Gain direct access to senior mentors for unparalleled professional development.
Key Responsibilities: • Create automated workflows with low-code solutions • Consolidate company data into AI-powered knowledge bases • Develop advanced chatbots to assist customers • Integrate Large Language Models into business applications • Perform prompt engineering for optimal AI output quality
Requirements: • Enrollment in a technical academic program is essential • Hands-on experience with Zapier or equivalent platforms • Understanding of RESTful API integrations • Familiarity with OpenAI ...
This AI Automation Internship targets students pursuing degrees in Computer Science, Engineering, or related fields. You’ll design and deploy intelligent solutions that showcase your talent while driving significant impact. Gain direct access to senior mentors for unparalleled professional development.
Key Responsibilities: • Create automated workflows with low-code solutions • Consolidate company data into AI-powered knowledge bases • Develop advanced chatbots to assist customers • Integrate Large Language Models into business applications • Perform prompt engineering for optimal AI output quality
Requirements: • Enrollment in a technical academic program is essential • Hands-on experience with Zapier or equivalent platforms • Understanding of RESTful API integrations • Familiarity with OpenAI ...
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Submit your application for the Internship in AI Automation Engineering position at Heitechsoft.
Apply Now Save for LaterJob Overview
Job Type:
Full-time
Location:
cambridge, Canada
Posted:
May 25, 2026
Deadline:
July 04, 2026