In
Posted:
May 26, 2026
Location:
ottawa, on, Canada
Job Description
Engage with Intel's ASIC Design Automation as an intern. Be at the forefront of revolutionizing design processes in the semiconductor industry through automation.
This internship offers a unique opportunity for students to immerse themselves in the fast-paced world of chip design at Intel. You will collaborate with a talented team, focusing on enhancing automation tools and workflows related to RTL design. A firm grasp of programming and digital design principles is helpful, but your enthusiasm and problem-solving abilities are paramount.
Key Responsibilities:
• Debug issues and improve automation efficiency
• Collaborate in a GitHub-managed environment
• Support frontend designers in automation challenges
• Maintain and enhance existing automation tools
• Contribute to project-based teamwork in semiconductor tasks
Requirements:
• Must be an active student in Computer Science or equivalent
• Basic knowledge of digital logic design
• Programming experien...
This internship offers a unique opportunity for students to immerse themselves in the fast-paced world of chip design at Intel. You will collaborate with a talented team, focusing on enhancing automation tools and workflows related to RTL design. A firm grasp of programming and digital design principles is helpful, but your enthusiasm and problem-solving abilities are paramount.
Key Responsibilities:
• Debug issues and improve automation efficiency
• Collaborate in a GitHub-managed environment
• Support frontend designers in automation challenges
• Maintain and enhance existing automation tools
• Contribute to project-based teamwork in semiconductor tasks
Requirements:
• Must be an active student in Computer Science or equivalent
• Basic knowledge of digital logic design
• Programming experien...
Apply for this Job
Submit your application for the Internship in ASIC Design Automation position at Intel Corporation.
Apply Now Save for LaterJob Overview
Job Type:
Full-time
Location:
ottawa, Canada
Posted:
May 26, 2026
Deadline:
July 05, 2026