Internship | Ultracompact Photonics Hardware for Next‑Generation Semiconductor Inspection

About this position

Advancing semiconductor manufacturing requires inspection technologies that are not only faster, but fundamentally more intelligent. This internship explores a novel photonic approach that uses metasurface based devices combined with machine learning classification to detect and characterize wafer defects with unprecedented precision. You will contribute to the first proof of concept experiment validating this concept, helping to demonstrate how ultracompact photonic structures and smart algorithms can outperform traditional sensing methods. By enabling high resolution, non contact optical inspection at much higher speeds, this work has the potential to redefine metrology in the semiconductor industry and support the next generation of high performance chips.

What will be your role?

As an intern, you will take a central role in building and validating the first proof of concept system for using metasurface based ph...