Ea
Posted:
March 01, 2026
Location:
Vantaa, Finland, Finland
Job Description
**What you’ll do:**
Power Electronics Hardware Lead and Subject Matter Expert in advanced component selection, circuit design, and hardware architecture for high-performance power conversion products and systems, guiding projects from concept through production launch.
**Key Responsibilities:**
- Provides expert-level knowledge in power semiconductor devices, magnetics, passive components, and thermal management.
- Leads detailed circuit design, layout optimization, and hardware integration for converters, inverters, and UPS systems.
- Performs advanced analysis and simulation for efficiency, reliability, and EMI/EMC compliance.
- Reviews and validates complex hardware designs, conducts root-cause analysis, and develops robust solutions for challenging applications.
- Mentors engineers globally and acts as a subject matter expert for critical hardware decisions.
- Participates in techn...
Power Electronics Hardware Lead and Subject Matter Expert in advanced component selection, circuit design, and hardware architecture for high-performance power conversion products and systems, guiding projects from concept through production launch.
**Key Responsibilities:**
- Provides expert-level knowledge in power semiconductor devices, magnetics, passive components, and thermal management.
- Leads detailed circuit design, layout optimization, and hardware integration for converters, inverters, and UPS systems.
- Performs advanced analysis and simulation for efficiency, reliability, and EMI/EMC compliance.
- Reviews and validates complex hardware designs, conducts root-cause analysis, and develops robust solutions for challenging applications.
- Mentors engineers globally and acts as a subject matter expert for critical hardware decisions.
- Participates in techn...
Apply for this Job
Submit your application for the Lead UPS Hardware Engineer position at Eaton Corporation.
Apply Now Save for LaterJob Overview
Job Type:
Full-time
Location:
Vantaa, Finland
Posted:
March 01, 2026
Deadline:
April 03, 2026