HS
Posted:
June 13, 2026
Location:
Mongkok, Hong Kong, Hong Kong
Job Description
Manager, Rewards and Loyalty - Hang Seng Bank (HK)
Location:
Mongkok, Kowloon, HK
Brand: Hang Seng Bank
Area of Interest:
Closing Date: Hybrid Worker
Date: 19 May 2026
**Job description**
**Some careers have more impact than others.**
If you’re looking for a career where you can make a real impression, join Hang Seng and discover how valued you’ll be. Whether you want a career that could take you to the top, or simply take you in an exciting new direction, Hang Seng offers opportunities, support and rewards that will take you further.
Manager, Rewards & Loyalty Management - Unsecured Lending and Payment
**Principal Responsibilities**
+ **Proposition innovation & development -** Identify customer needs and pain points, and competitor gaps; design improved rewards journeys and new features (including digital-first and personalised experiences) to strengthen rewards capability and optimi...
Location:
Mongkok, Kowloon, HK
Brand: Hang Seng Bank
Area of Interest:
Closing Date: Hybrid Worker
Date: 19 May 2026
**Job description**
**Some careers have more impact than others.**
If you’re looking for a career where you can make a real impression, join Hang Seng and discover how valued you’ll be. Whether you want a career that could take you to the top, or simply take you in an exciting new direction, Hang Seng offers opportunities, support and rewards that will take you further.
Manager, Rewards & Loyalty Management - Unsecured Lending and Payment
**Principal Responsibilities**
+ **Proposition innovation & development -** Identify customer needs and pain points, and competitor gaps; design improved rewards journeys and new features (including digital-first and personalised experiences) to strengthen rewards capability and optimi...
Apply for this Job
Submit your application for the Manager, Rewards and Loyalty - Hang Seng Bank (HK) position at HSBC.
Apply Now Save for LaterJob Overview
Job Type:
Full-time
Location:
Mongkok, Hong Kong
Posted:
June 13, 2026
Deadline:
June 18, 2026