Nanofabrication and Semiconductor Package Failure Analysis Engineer

Summary NIST's Intelligent Systems Division is seeking a Nanofabrication and Semiconductor Package Failure Analysis Engineer to conduct cutting-edge research in nanofabrication and semiconductor package failure analysis. This role will aid in the advancement of semiconductor and advanced packaging technologies. This notice is issued under direct-hire authority to recruit new talent to occupations for which NIST has a severe shortage of candidates. Responsibilities NIST's Intelligent Systems Division leads efforts to develop, advance, and deploy measurement science and standards to accelerate the development, adoption, and integration of leading-edge intelligent technologies and improve U.S. manufacturing performance. Within the division, the Production Systems Group conducts research to improve scientific understanding and control of manufacturing processes, equipment, and workpiece properties. The research of this group leads to the development of methods and instrumentation for chara...