Packaging Development Engineer (NCG)

Sandisk
full-time Shanghai, Shanghai Engineers
Posted:
March 04, 2026
Location:
Shanghai, Shanghai, China

Job Description

Job Description

  1. Packaging Development Engineer
  2. New technology, material and equipment design, development and deployment in co-operation with internal and external team. 
  3. New product design, development and deployment until product move to mass production.
  4. Bring innovation solution and technology across new technology and new product development.
  5. Team work in English language with a multitude of international interfaces is mandatory.

Qualifications

  1. Master degree with major in material science / Mechatronic Technology as priority. 
  2. Preferred intern in assembly technology especially in SanDisk or similar company.
  3. Passion for developing technical solutions in multidisciplinary international projects
  4. Excellent English skills (verbal and written); willingness to travel as required.


Additional Information

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Job Overview

Job Type: full-time
Location: Shanghai, China
Posted: March 04, 2026
Deadline: April 13, 2026