Packaging Engineer - Inductor and Power Module

The Emerging Packaging and Test Team at Texas Instruments is looking for a Magnetics and Passives Integration Technologist



+ Lead the definition, development and realization of comprehensive low-profile inductors, planar magnetics, and integrated passives roadmaps to enable ultra-compact, high-density, high current (100-300A) power delivery modules for enterprise and AI infrastructure

+ Develop strategic relationships and partnerships with leading suppliers worldwide to co-develop magnetic materials, inductors, capacitors, and packaging technologies that meet performance, reliability, and scaling needs.

+ Ensure manufacturability, testability and reliability through early-stage DfX, material qualification, and close supplier collaboration.



The candidate must be a proven leader, capable of working collaboratively across worldwide cross functional teams and accelerating development cycles to meet aggressive time-to market targets.