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Posted:
March 01, 2026
Location:
United States, United States, United States
Job Description
**Change the world. Love your job.**
As a member of our Packaging team, you'll have the chance to interact with many product groups and functions. You'll have high visibility on your projects, with strong opportunities for growth both within our team and across the SC Packaging organization.
**Responsibilities may include:**
+ To define, design, develop and scale to volume production high voltage (200-3300V) packages and high-power modules for the Industrial, Automotive, Renewable and Telecom markets.
+ The candidate must understand market trends & end equipment system requirements and build these into competitive forward-looking package and module roadmaps.
+ The candidate must have the ability to define solutions across various HV technologies like GaN, SiC, IGBT and Isolation Technologies and validate these using CFD, thermomechanical and electrical parasitic extraction tools.
+ The candidate will develop new process flows/technologies necessary t...
As a member of our Packaging team, you'll have the chance to interact with many product groups and functions. You'll have high visibility on your projects, with strong opportunities for growth both within our team and across the SC Packaging organization.
**Responsibilities may include:**
+ To define, design, develop and scale to volume production high voltage (200-3300V) packages and high-power modules for the Industrial, Automotive, Renewable and Telecom markets.
+ The candidate must understand market trends & end equipment system requirements and build these into competitive forward-looking package and module roadmaps.
+ The candidate must have the ability to define solutions across various HV technologies like GaN, SiC, IGBT and Isolation Technologies and validate these using CFD, thermomechanical and electrical parasitic extraction tools.
+ The candidate will develop new process flows/technologies necessary t...
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Apply Now Save for LaterJob Overview
Job Type:
Full-time
Location:
United States, United States
Posted:
March 01, 2026
Deadline:
March 06, 2026