Packaging Module Equipment Development Engineer

Intel
Full-time Phoenix, AZ other-general
Posted:
June 17, 2026
Location:
Phoenix, AZ, United States

Job Description

**Job Details:**

**Job Description:**

Note: This role requires regular onsite presence to fulfill essential job responsibilities.

Develops assembly processes and/or equipment and applies innovative engineering concepts to support Intel’s future assembly packaging platform technologies. Optimizes manufacturing processes to improve quality, reliability, cost, yield, productivity, and manufacturability.

Develops process and equipment specifications using Design of Experiments (DOE), Statistical Process Control (SPC), and data analysis methodologies to drive process optimization and continuous improvement. Documents technical findings, process improvements, and best practices through technical reports and white papers.

Develops and maintains equipment used to evaluate silicon and package technologies under simulated field-use conditions, including heat, humidity, temperature cycling, and dynamic force environments. Ensures manufacturability of p...

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Job Overview

Job Type: Full-time
Location: Phoenix, United States
Posted: June 17, 2026
Deadline: June 22, 2026