PCBA Packaging Technician — Hands-on Process & Growth

Intel Corporation
Full-time , , Malaysia, , , Malaysia Engineering
Posted:
March 02, 2026
Location:
, , Malaysia, , , Malaysia, Malaysia

Job Description

A leading semiconductor manufacturer in Malaysia is seeking a Package Engineering Technician to support the development of printed circuit board assembly processes. The ideal candidate will have a diploma in Mechanical or Electronics and at least 3 years of relevant manufacturing experience. Key responsibilities include evaluating engineering data, operating equipment, and optimizing processes. This full-time role is on-site in Kulim, offering an opportunity to work in a dynamic and innovative environment.
#J-18808-Ljbffr

Apply for this Job

Submit your application for the PCBA Packaging Technician — Hands-on Process & Growth position at Intel Corporation.

Apply Now Save for Later

Job Overview

Job Type: Full-time
Location: , , Malaysia, Malaysia
Posted: March 02, 2026
Deadline: April 11, 2026