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PCBA Packaging Technician — Hands-on Process & Growth
Intel Corporation
Full-time
, , Malaysia, , , Malaysia
Engineering
Posted:
March 02, 2026
Location:
, , Malaysia, , , Malaysia, Malaysia
Job Description
A leading semiconductor manufacturer in Malaysia is seeking a Package Engineering Technician to support the development of printed circuit board assembly processes. The ideal candidate will have a diploma in Mechanical or Electronics and at least 3 years of relevant manufacturing experience. Key responsibilities include evaluating engineering data, operating equipment, and optimizing processes. This full-time role is on-site in Kulim, offering an opportunity to work in a dynamic and innovative environment.
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Submit your application for the PCBA Packaging Technician — Hands-on Process & Growth position at Intel Corporation.
Apply Now Save for LaterJob Overview
Job Type:
Full-time
Location:
, , Malaysia, Malaysia
Posted:
March 02, 2026
Deadline:
April 11, 2026