Photonic Process Engineer: Wire Bonding & Die Attach

Ciena Corporation

Full-time ottawa, on Other-General

Posted:

June 04, 2026

Location:

ottawa, on, Canada

Job Description

                    A leading technology firm in Ottawa is seeking a motivated Process Engineer to optimize assembly processes for Photonic Integrated Circuit products. The ideal candidate has a Bachelor’s degree in mechanical engineering and 2–3 years of relevant experience. Responsibilities include designing wire bonding recipes and conducting reliability testing. Competitive salary range of $71,600 to $114,400 and comprehensive benefits offered.
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Job Overview

Job Type: Full-time

Location: ottawa, Canada

Posted: June 04, 2026

Deadline: July 14, 2026