NX
Physical Failure Analysis Engineer
NXP Semiconductors
Full-time
Kuala Lumpur, Kuala Lumpur
Other-General
Posted:
February 28, 2026
Location:
Kuala Lumpur, Kuala Lumpur, Malaysia
Job Description
Physical Failure Analysis (PFA) Involves The Localisation, Imaging, And Characterisation Of Manufacturing Defects In Our Products. Analysts Will Be Expected To
Utilise a wide variety of fault localisation and imaging tools/techniques, including but not limited to Scanning Electron Microscope (SEM), Transmission Electron Microscope (TEM), Energy Dispersive X-ray Spectroscopy (EDX), Focused Ion Beam (FIB), SEM-based Nanoprober
Understand electrical failure analysis (EFA) data and determine the best PFA plan forward based on that data
Document findings in professional reports to be shared with various stakeholders
Collaborate with cross-departmental teams such as Customer Quality Engineering, Manufacturing, and other FA labs
Have an understanding of manufacturing processes and the root cause of defects
Job Qualification
Bachelor's or Master's degree in Electrical/Electronics/Materials Engineering
Fresh Graduates or with not more than 2 years' work experience
Bas...
Utilise a wide variety of fault localisation and imaging tools/techniques, including but not limited to Scanning Electron Microscope (SEM), Transmission Electron Microscope (TEM), Energy Dispersive X-ray Spectroscopy (EDX), Focused Ion Beam (FIB), SEM-based Nanoprober
Understand electrical failure analysis (EFA) data and determine the best PFA plan forward based on that data
Document findings in professional reports to be shared with various stakeholders
Collaborate with cross-departmental teams such as Customer Quality Engineering, Manufacturing, and other FA labs
Have an understanding of manufacturing processes and the root cause of defects
Job Qualification
Bachelor's or Master's degree in Electrical/Electronics/Materials Engineering
Fresh Graduates or with not more than 2 years' work experience
Bas...
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Job Type:
Full-time
Location:
Kuala Lumpur, Malaysia
Posted:
February 28, 2026
Deadline:
April 09, 2026