Principal Engineer Package Design Development

We are seeking an experienced Principal Engineer Package Design Development to lead packages design and development for automotive products. This role provides technical leadership across cross-functional teams, drives design innovation and supports product development.
Your Role
Key responsibilities in your new role

• Package Design and Development: Design and develop Flip chip BGA and Wirebond BGA Package technologies, ensuring optimal performance, reliability, and manufacturability for Automotive products.
• Technical Advisor: Provide technical guidance and expertise to OSAT partners on package technology development, including specifying requirements, developing, verifying, and validating new or modified package technologies.
• Technical Leadership: Drive technical decision-making and set direction within OSAT for the development and pre-development of new package technologies, processes, and materials.
• Problem-Solving and Anal...