Principal Packaging Engineer: Lead Frame & NPI Expert

A leading semiconductor company is seeking a Principal Packaging Engineer to drive packaging process engineering. The role requires overseeing lead frame package assembly, ensuring high product quality and yield improvement while working closely with internal teams and external partners. Ideal candidates will have at least 12 years of experience in semiconductor packaging technology, solid project management skills, and a Bachelor's degree in a related field. This position is based in Malaysia and offers a dynamic environment focused on innovation.
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