Job Description
CSA Catapult is seeking a Principal Semiconductor Packaging Engineer to lead and architect cutting-edge 3D and 2.5D semiconductor packaging technologies , including advanced interconnects, system-in-package (SiP), chiplet integration, and high-bandwidth interface packaging. This is a strategic technical role combining deep packaging expertise with systems-level design thinking to define and deliver next-generation packaging platforms.
As a senior technical authority, you will lead internal and collaborative R&D programs and interface with global industry and academic partners to deliver packaging solutions for heterogeneous integration, targeting applications in AI, HPC, power electronics, RF, and photonics. You will be expected to provide design expertise on projects, analysis, assembly, and technical guidance on test and validation activities, participating in labs at Catapult’s Innovation Centre.
This position drives all packaging aspects of prototype...
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