Posted:
March 03, 2026
Location:
Singapore, Singapore, Singapore

Job Description

Micron’s vision is to transform how the world uses information to enrich life for all. Join a world-class global team focused on one thing: using our expertise in the relentless pursuit of innovation to enable high-value technology-driven solutions for customers and partners. The solutions we create help make everything from virtual reality experiences to breakthroughs in supercomputing and artificial intelligence possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can spark the very innovation we are pursuing.

We are currently experiencing a ground‑breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to de...

Apply for this Job

Submit your application for the Principal/Senior Engineer, APTD CEM - Advanced Packaging Integration Engineering position at MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD..

Apply Now Save for Later

Job Overview

Job Type: Full-time
Location: Singapore, Singapore
Posted: March 03, 2026
Deadline: April 12, 2026