Process Development Engineer (Wire bond Package R&D)
NexperiaJob Description
As a Process Development Engineer (WB), you will develop and optimize semiconductor assembly processes to meet project Functional Requirement Specifications (FRS), ensuring robust manufacturability, reliability, and high-quality output for new products and platforms.
What You Will Do
Develop and characterize new semiconductor process technologies, applying structured engineering methods such as DOE, SPC, FMEA, and Six Sigma
Drive end-to-end process development from concept to stable, high-yield manufacturing solutions
Provide technical input for assembly processes and equipment solutions for new products and platforms
Lead technical discussions and troubleshooting on wire bond and related FOL processes across project teams and sites
Apply wafer metallization knowledge to optimize process performance and stability
Conduct benchmarking and technology studies to support package roadmap and...
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