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Posted:
June 17, 2026
Location:
Ithaca, NY, United States
Job Description
Wafer Fab Process Engineer will work in the class 100 semiconductor facility and will perform multiple operations including: cleaning and coating wafers; aligning wafers using mask aligners, metal/dielectric deposition and etching, baking and annealing, inspections, performing tool calibrations, carry out DOE runs analyze and report data.
Working hours will be 10:00am – 7:00pm with flexibility to cover portion of the second shift as needed
Experience:
Candidate must have 2+ years experience with contact/stepper lithography, e-beam evaporation/ Sputtering, lift-off process, RTP, Furnace anneal, ALD, PECVD of SiO2 and Si3N4 and RIE/ICP processes of dielectrics and semiconductors materials.
Education:
BS in Science, Engineering or equivalent.
Power Integrations is committed to building teams that drive innovation and therefore review a range of factors when determining compensation. The annual base pay range for this position is $65,000 0 - $90,000. ...
Working hours will be 10:00am – 7:00pm with flexibility to cover portion of the second shift as needed
Experience:
Candidate must have 2+ years experience with contact/stepper lithography, e-beam evaporation/ Sputtering, lift-off process, RTP, Furnace anneal, ALD, PECVD of SiO2 and Si3N4 and RIE/ICP processes of dielectrics and semiconductors materials.
Education:
BS in Science, Engineering or equivalent.
Power Integrations is committed to building teams that drive innovation and therefore review a range of factors when determining compensation. The annual base pay range for this position is $65,000 0 - $90,000. ...
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Job Type:
Full-time
Location:
Ithaca, United States
Posted:
June 17, 2026
Deadline:
June 22, 2026