Process Engineer, Semiconductor Packaging – Pilot Line

Karlstad University is looking to fill up to three Process Engineer positions specializing in semiconductor packaging. You will be responsible for leading process development in areas such as flip-chip bonding and dicing.

The ideal candidate holds an M.Sc. or Ph.D. and has at least three years of experience in semiconductor packaging. This role requires hands-on problem solving and collaboration with industry and academia.

Competitive benefits include a flexible work schedule and opportunities for substantial impact in the semiconductor community.