Process Engineer

About Stats ChipPAC

At Stats ChipPAC, we are at the forefront of the global semiconductor Outsourcing Assembly and Test (OSAT) industry, enabling tomorrow's technology — from mobile devices to high-performance computing. Join our dynamic team where innovation, teamwork, and excellence drive our success. We are employing Advanced Manufacturing Technologies in our Wafer-Level Packaging operations with wide adoption of Automation, AI-enabled inspection and Autonomous Mobile Robots (AMR) as substitute to manual operations.

Scope of the Job:

• In charge of Solder Plating & Nickel Plating process development, co-work with R&D team
• In charge of establishing high volume manufacturing process capability for Solder Plating & Nickel Plating process
• In charge of creating new recipe setup for every new device.  Process characterization for every new device: bump dimension, bump shear, bump void.  Process monitoring:  Concentration, Lifespan & Condition o...