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Product Engineer II - Memory IP
Cadence Design Systems, Inc.
Full-time
Shanghai, China
other-general
Posted:
June 06, 2026
Location:
Shanghai, China, China
Job Description
At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology.
Product Engineer – Memory IP Products
Join a growing and dynamic IP team and help lead the proliferation of best-in-class Memory PHY IP products across a wider range of customers. This is a tremendous opportunity to work with an experienced team focusing on development and support of high-performance IP related to memory protocols such as DDR/LPDDR/HBM/GDDR, and to engage with the technology sector’s top companies making an impact in our world.
The role will be a key member of technical staff in an organization responsible for activities including but not limited to pre-sales engagement with potential customers and post-sales technical support for integration, usage, and deployment of memory physical IP producs. This candidate will be the primary interface between customers, CDNS R&D and System Validation teams. Candidate should possess strong ...
Product Engineer – Memory IP Products
Join a growing and dynamic IP team and help lead the proliferation of best-in-class Memory PHY IP products across a wider range of customers. This is a tremendous opportunity to work with an experienced team focusing on development and support of high-performance IP related to memory protocols such as DDR/LPDDR/HBM/GDDR, and to engage with the technology sector’s top companies making an impact in our world.
The role will be a key member of technical staff in an organization responsible for activities including but not limited to pre-sales engagement with potential customers and post-sales technical support for integration, usage, and deployment of memory physical IP producs. This candidate will be the primary interface between customers, CDNS R&D and System Validation teams. Candidate should possess strong ...
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Job Type:
Full-time
Location:
Shanghai, China
Posted:
June 06, 2026
Deadline:
June 11, 2026